IC & Sensor Packaging Technology Expo 27.04.2024 03:44 Description: Packaging Technologies for Semiconductors, LED, MEMS, Sensors www: www.icp-expo.jp Location: Tokyo Big Sight 3-21-1 Ariake, Koto-ku, Tokyo 135-0063 Japan Categories: Manufacture of electronic and optical products, machinery n.e.c. Timetable: January 16, 2019 - January 18, 2019 Share